Standard Size And Specification:

 

Property	Details
Product	Molybdenum Disc, Molybdenum Square
Standard	ASTM B386, type 361/364
Material	Mo ≥ 99.95%, TZM Alloy
Molybdenum Discs Size	5~100mm diameter x 0.2~12mm thickness
Molybdenum Square Size	25~100mm² x 0.5~12.0mm thickness
ASTM B386 Squares Density	9.8 ~ 10.2 g/cc
Surface	Chemically cleaned, Grinding, As rolled
Tensile Strength	485-690 MPa
Thermal Expansion (25 °C)	4.8 µm-m-1-K-1
Electrical Resistivity	0.25 kJ/kg K
Purity	Mo > 99.95% for pure Mo
Roughness	Ra 0.8
ASTM / ASME Standard	ASTM B386, ASME SB386
Applications	• Transistors • ICs, LSI’s and Hybrid Circuits (as heat sink bases) • Silicon Controlled Rectifiers, Diodes
Flatness Tolerance	< 4µm
Type of Molybdenum Discs	• ASTM B386 Type 361 Round • Mu0082 Moly Circle • Molybdenum Square Disc • TZM Alloy Disc • Molybdenum Alloy Discs • Molybdenum Mesh Disc • Round Molybdenum Disc • Mola Alloy Disc

 

Chemical Composition:

 

Element	Mo-1	Mo-2
**Mo**	Balance	Balance
Fe	0.005	0.02
Ni	0.002	0.005
Al	0.002	0.005
Si	0.002	0.01
Ca	0.002	0.005
Mg	0.001	0.003
P	0.001	0.002
C	0.006	0.01
O	0.006	0.08
N	0.003	–
Pb	–	0.001
Bi	–	0.001
Sn	–	0.001
Sb	–	0.001
Cd	–	0.001

 

Physical Properties:

 

Property	Value
Molecular Weight	95.94
Appearance	Silvery
Melting Point	2623 °C
Boiling Point	4639 °C
Density	10.28 g/cm³
Solubility in H₂O	N/A
Electrical Resistivity	0.25 kJ/kg K **(Note: This is an incorrect unit for resistivity)**
Electronegativity	1.9 Paulings
Heat of Fusion	37.8 kJ/mol
Heat of Vaporization	598 kJ/mol
Poisson’s Ratio	0.31
Specific Heat	0.25 kJ/kg K
Tensile Strength	485-690 MPa
Thermal Conductivity	138 W/m K
Thermal Expansion (25 °C)	4.8 µm-m⁻¹-K⁻¹
Vickers Hardness	1530 MPa
Young’s Modulus	329 GPa

 

Mechanical Behavior:

 

THICKNESS (inch)	DIAMETER (inch)
0.1-0.3	0.004-0.012
0.31-0.5	0.012-0.020
0.51-1.0	0.020-0.040
1.1-2.0	0.040-0.080
2.1-3.0	0.080-0.120
3.1-4.0	0.120-0.160
4.1-6.0	0.160-0.240

 

Grade:

 

Grade	Mo-1	Mo-2	Mo-3
Mo (%)	≥99.95	99.95	99.92
Pb	–	–	0.001
Bi	–	–	0.001
Sn	–	–	0.001
Sd	–	–	0.001
Cd	–	–	0.001
Fe	0.005	0.006	0.030
Ni	0.002	0.001	0.005
Al	0.002	0.002	0.005
Si	0.003	0.001	0.010
Ca	0.002	0.002	0.004
Mg	0.001	0.001	0.003
P	0.001	0.001	0.002
C	0.005	0.003	0.010
O	0.003	0.005	0.008
N	0.001	0.001	–

 

Temperature Limit:

 

Property	Value
Temperature	500°C to 700°C

 

Size:

 

Property	Mo Disc	Mo Square
Diameter	0.2″ – 5.9″ ±.0001″	0.08″ – 4″
Thickness	0.008″ – 0.47″	0.004″ – 0.12″
Surface Roughness	Ra < 0.06 mm	Ra < 0.06 mm
Flatness/Parallelism	< 0.01 mm	–
Coating (PVD or EP)	Ru, Rh, Ni, Ag, Au, etc.	Ru, Rh, Ni, Ag, Au, etc.

 

Feature:

• Molybdenum Discs from Achemetal is under vacuum annealing and leveling before delivery
• Surface of Molybdenum Discs and plate has metallic silver luster
• Molybdenum Discs adopts the material Molybdenum with a high purity of 99.9%
• Its radiation shielding effect is equivalent to that of lead plate
• Our Molybdenum Discs and plate can be as thin as 0.1mm

 

Stock of Molybdenum Round Disc:

 

Ready stock of Molybdenum Round Disc, Moly Alloy 364 Squares, Tzm Alloy Disc as per Mola Alloy Disc, Mo-la Alloy Disc in Round & Square.

 

Product Name (Column 1)	Product Name (Column 2)
Molybdenum Disc	Molybdenum Square Discs
Molybdenum Alloy Discs	ASME SB386 Molybdenum Foil
Molybdenum Round Disc	Tzm Alloy Disc
Molybdenum Discs	Pure Polished Molybdenum Disc
Round Molybdenum Disc	Mola Alloy Disc
Mu0082 Molybdenum Disc	Moly Disc
Mo Square	Mo Alloy Discs
Thin Molybdenum Metal Discs	Molybdenum Mesh Disc
Mo-la Alloy	TZM Mo1 Sheet
Mo Disc	TZM Mo2 Coils

 

Applications of Molybdenum Discs:

 

We supply various types of Molybdenum Mesh Disc like Mo Alloy Discs, Molybdenum Square Discs per Molybdenum Discs.

• Thyristors (GTO’s)
• Silicon Controlled Rectifiers Diodes
• Heat Sink Bases in ICs, LSIs and Hybrid Circuits
• Used for contact materials in silicon controlled rectifiers diodes, transistors, and thyristors (GTO’s).
• Transistors
• Used as heat sink bases in ICs, LSIs and hybrid circuits.
• Used as an electronic component of high power and high-reliability semiconductor for heat dissipation.